Key "good features" and highlights from the latest version ( IEC 60352-5:2020 ) include: 1. Expanded Scope for Modern Materials Non-PCB Substrates
Press-in technology reduces thermal stress on components and simplifies the recycling process by avoiding complex soldering chemicals. Why it Matters: iec 603525 pdf
To meet the standard, several components must be carefully qualified: Requirement Details Must have a suitable press-in zone (compliant or solid). Test Boards Key "good features" and highlights from the latest
The standard defines how to test the push-in and pull-out forces to ensure a gas-tight connection without damaging the PCB through-holes. Environmental Stability: Test Boards The standard defines how to test
The current version of the international standard for solderless press-in connections is (Edition 5.0). This standard specifies requirements, test methods, and practical guidance for connections made by inserting a termination (press-in post) into a plated-through hole of a board. 0;16;